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Yongqin Liu<yongqin.liu@linaro.org>
device-common.mk: bump PRODUCT_SHIPPING_API_LEVEL to 32
719dc6d5
3258
commits
audio
build
etc
factory-images
gralloc
gralloc960
hikey
hikey32
hikey64
hikey960
installer
overlay
power
recovery
self-extractors_hikey960
sensorhal
sepolicy
vr
Android.bp
Android.mk
AndroidProducts.mk
BoardConfigCommon.mk
METADATA
compatibility_matrix.xml
device-common.mk
fetch-vendor-package.sh
fstab.ramdisk
hikey-common.mk
hikey.mk
hikey32.mk
hikey64_only.mk
hikey960.mk
hikey960_tv.mk
hikey_tv.mk
init.common.nanohub.rc
init.common.rc
init.hikey.power.rc
init.hikey960.power.rc
init.recovery.common.rc
manifest.xml
p2p_supplicant_overlay.conf
product.prop
proprietary-blobs.txt
system.prop
ueventd.common.rc
vendor-package-ver.mk
vendor-package-ver.sh
vendor_owner_info.txt
wpa_supplicant.conf
wpa_supplicant_overlay.conf
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